2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Southco Inc. - POWER UP YOUR CHARGING DESIGN
With engineered access solutions for electric vehicle charging equipment. Southco's engineered access hardware, including locks, latches and hinges can help Electric Vehicle (EV) charging manufactures to achieve high standards of equipment performance, usability and security, providing a seamless charging experience for drivers.
