2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
Records 1 to 1 of 1
Featured Product
Terrasmart - Reduce Risk and Accelerate Solar Installations
We push the limits in renewable energy, focusing on innovation to drive progress. Pioneering new solutions and ground-breaking technology, and smarter ways of working to make progress for our clients and the industry.
